Numerical Study of The Mould Contours Effect on The Plate Cooling Process Heated From The Side

International Journal of Mechanical Engineering

© 2019 by SSRG - IJME Journal

Volume 6 Issue 7

Year of Publication : 2019

Authors : Muttaqin Rahmat Pangaribawa, Fauzun

10.14445/23488360/IJME-V6I7P103

How to Cite?

Muttaqin Rahmat Pangaribawa, Fauzun, "Numerical Study of The Mould Contours Effect on The Plate Cooling Process Heated From The Side," SSRG International Journal of Mechanical Engineering, vol. 6,  no. 7, pp. 14-20, 2019. Crossref, https://doi.org/10.14445/23488360/IJME-V6I7P103

Abstract:

Cooling reconstruction of the plate heated from the side on the mould contour can be optimized. This research was performed by observing, documenting, document studying, simulating, and simulating based on optimization.The research aims of finding out the cooling effect, the cooling distance compared with the flat plate, and the cooling effectiveness.Based on the simulation result, the reconstruction cancool effectively.The minimum distance to cool the packaging mould contour is equal to 15 mm with the cell size 2 x 1.6 mm (Lr =2, H =1.6) with the type of 1 l packaging mould. Cooling depth of the contour plate optimum is 4.57 times that of the flat plate. The packaging cooling effectiveness of 1 l grip packaging simulation based on optimization is 70.85%: 70.77% and for 1 l non-grip is 71.09%: 71.04% compared with simulation so that the production rate of 1 l grip packaging increased 0.11% and 1 l non-grip packaging increased 0.07%.This method has the potential to resolve the main problem in the blowing mould cooling process.

Keywords:

mould contour, flat plate optimization, side heating, cooling effectiveness, cell

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