Thermal Interface Conductance of Realistic Bolted Joints in Vacuum Environment

International Journal of Mechanical Engineering

© 2018 by SSRG - IJME Journal

Volume 5 Issue 9

Year of Publication : 2018

Authors : Sujana N, Dr.Amrit Ambirajanb, Dr.N.Shanmughapriya

10.14445/23488360/IJME-V5I9P103

How to Cite?

Sujana N, Dr.Amrit Ambirajanb, Dr.N.Shanmughapriya, "Thermal Interface Conductance of Realistic Bolted Joints in Vacuum Environment," SSRG International Journal of Mechanical Engineering, vol. 5,  no. 9, pp. 17-21, 2018. Crossref, https://doi.org/10.14445/23488360/IJME-V5I9P103

Abstract:

Conduction is the process of heat transmission from one medium to another medium; this plays a vital role in the space environment. The heat will be generated from the spacecraft's electronic box, which should flow from the conducting medium to the box surface. In contrast, it must either radiated or conducted to the heat sink. Therefore, the study of contact conductance is an important phenomenon; hence, this article deals with temperature and pressure variations /distribution between mating surfaces when two different thickness plates are brought together and joined using M4 bolts in a vacuum environment and correlated with analytical results.

Keywords:

Thermal interface conductance, realistic bolted joints, vacuum environment, space environment, aluminum 6061, micro capsulated sheet, mikic relation.

References:

[1] "The parameters affecting on Thermal contact conductance-A Review" Ms. Kumkum B. Chauhan1, Prof. Hitesh R. Raiyani2 1M.E. Scholar, L.J. Institute of Engineering & Technology, Ahmedabad 2Assistant Professor, L.J. Institute of Engineering & Technology, Ahmedabad
[2] "Thermal Conductance," Springer Publications, C.Madhusudana,1996
[3] Shanmugan S, Mutharasu D"Thermal transient analysis of high power LED tested on Al2O3 thin film coated Al substrate", International Journal of Engineering Trends and Technology (IJETT), V30(6),270-275 December 2015. ISSN:2231-5381.
[4] "Thermal contact conductance": Louis J Salerno and peter Kittel, Ames Research center California(1997):
[5] "Thermal contact conductance," M. Cooper, B. Mikic, M. Yovanovich Int. J. Heat Mass Transfer 12 (1969) 279–300.
[6] "Thermal contact conductance; theoretical considerations," B. Mikic', Int. J. Heat Mass Transfer 17 (1974) 205–214.
[7] "An Experimentally validated thermo-mechanical model for the prediction of thermal contact conductance" "Vishal Singhal, Paul J.Litke, Antony F. Black, Suresh V.Garimella cooling technologies Research center, school of mechanical engineering, Purdue University, West Lafayette, USA
[8] "Estimation of thermal conductance on metallic contact interface in vacuum" T. ~attori', M. ~akamura' & Y. saitou2 '~ech. Eng. Res. Lab., Hitachi Ltd., Japan 2~uclear System Division, Hitachi Ltd., Japan
[9] "Determination of the Thermal Characteristics of Flat Solids" Pavel V. Balabanov, Vasiliy Pogonin, and Alexander N. Pchelintsev Tambov State Technical University ul. Sovetskaya 106, Tambov, 392000 Russian Federation.